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Isixhumi seTywina seShrink Solder sobushushu
Indandatho yesolder isetyenziselwa ukutywina, idla ngokuba yindandatho yesolder kunye nezinto ze-PE. Izinto eziphambili zendandatho yesolder yisolder, edla ngokuba yi-alloy yetin kunye ne-lead. Ine-melting point ephantsi, i-fluidity elungileyo kunye ne-electrical conductivity.
Imisebenzi ephambili
1. Ukukhuthaza ukuwelda: Indandatho ye-solder ingabonelela nge-solder enyibilikisiweyo ngexesha lenkqubo yokuwelda, incede umphezulu wokuwelda ukuba wenze i-welding joint efanayo, ngaloo ndlela ikhuthaza inkqubo yokuwelda.
2. Ukulwa ne-oxidation: Isixhobo esisebenzayo kwiringi ye-solder sinokuthintela ngempumelelo i-oxidation ngexesha lenkqubo ye-welding kwaye sigcine umphezulu we-welding ucocekile kwaye umanzi kakuhle.
3. Umgangatho wokuwelda ophuculweyo: Ngokusebenzisa amaringi afanelekileyo okunyibilikisa, umgangatho kunye nokuthembeka kokutywina kunokuphuculwa kwaye ukuvela kweziphene zokutywina kunokuncipha.
Imiyalelo Yokusebenza
Okokuqala, faka iingcingo ezikrazulweyo kwiringi ye-solder. Emva koko, fudumeza isixhumi ngokusebenzisa i-heat gun, nto leyo ebangela ukuba i-solder inyibilike. Ekugqibeleni i-insulation iyancipha ize yenze i-clock eqinileyo ejikeleze iingcingo.
Izicelo zeeringi ze-Heat shrink solder rings kumashishini ahlukeneyo, kuquka iimoto, iinqanawa, ii-aerospace, kunye nonxibelelwano. Zisetyenziswa rhoqo kwizicelo apho kufuneka uqhagamshelo oluthembekileyo noluvalwe ngokusingqongileyo, njengakwii-wiring harnesses, ukulungiswa kombane, kunye nokufakelwa kwiindawo ezinzima okanye zangaphandle. Amandla eeringi ze-heat shrink solder rings ukubonelela ngoqhagamshelo oluqinileyo, olungangeni manzi, nolugqunywe ngobushushu azenza zibe lukhetho olukhethwayo kwiimeko apho iindlela zemveli ze-soldering zisenokungasebenzi okanye zinganeli.
Ngamafutshane, iiringi ze-heat shrink solder zibonelela ngeenzuzo zokubonelela ngoqhagamshelo oluxutyiweyo, ubushushu, kunye nokhuseleko lokusingqongileyo kwicandelo elinye. Usetyenziso lwazo lubandakanya amashishini apho uqhagamshelo lombane oluthembekileyo noluvaliweyo lubalulekile. Ngenxa yokulula kokusetyenziswa kwazo kunye nokukwazi ukwenza uqhagamshelo oluhlala ixesha elide nolungangeni manzi, iiringi ze-heat shrink solder ziyaqhubeka nokuba sisisombululo esixabisekileyo kwiimfuno ezahlukeneyo zocingo kunye nokufakelwa kombane.
Iiparameters zobugcisa
| INOMBOLO YENTO | Imveliso | Icandelo leNkokeli | Umbala oqhelekileyo | UKUZOBA | ||
| A1(umzuzu) | A2(umzuzu) | L(umzuzu.) | I-A.WG(mm) | |||
| I-SST-11 | 1.8 | 2.5 | 26 | 26-24(0.25-0.34) | Mhlophe |  |
| I-SST-21 | 2.7 | 3.8 | 40 | 22-18(0.5-1.0) | Bomvu | |
| I-SST-31 | 4.6 | 5.7 | 40 | 16-14(1.5-2.5) | Luhlaza | |
| I-SST-41 | 5.7 | 7.2 | 40 | 12-10(4.0-6.0) | Lubhelu | |
| I-SST-51 | 3.9 | 4.8 | 40 | 18-16(0.75-15) | Luhlaza | |
| I-SST-61 | 5.4 | 6.5 | 40 | 14-12(1.5-2.5) | Mfusa | |
| SST-71 | 6.6 | 8.5 | 42 | 8(8,0) | Orenji | |